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Resonance and damping in CMOS circuits with on-chip decoupling capacitance

机译:具有片上去耦电容的CMOS电路中的谐振和阻尼

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Design of on-chip decoupling capacitance and modeling of resonance effects in the power supply network of CMOS integrated circuits is addressed. The modeling is based on mathematical limits proving that damping will be low, resulting in resonance unless careful design is used. Design strategies that reduce resonance are discussed. It is shown that an optimal parasitic resistor in series with the decoupling capacitor gives a maximum damping factor of 0.5 and practical values are within the range 0.3-0.4. Examples of digital circuits show that proper design of on-chip decoupling capacitance may reduce the number of bonding wires by an order of magnitude. The modeling and design suggestions are also applicable to mixed-mode circuits. In particular, sampled analog networks benefit with a potentially higher sampling rate if enhanced damping is introduced during design.
机译:解决了片上去耦电容的设计和CMOS集成电路电源网络中谐振效应的建模。该建模基于数学极限,证明阻尼将很低,除非使用仔细的设计,否则会引起共振。讨论了减少共振的设计策略。结果表明,与去耦电容串联的最佳寄生电阻的最大阻尼系数为0.5,实用值在0.3-0.4范围内。数字电路的示例表明,适当设计的片上去耦电容可以将键合线的数量减少一个数量级。建模和设计建议也适用于混合模式电路。特别是,如果在设计过程中引入了增强的阻尼,则采样的模拟网络可能会受益于更高的采样率。

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