The coming of CSP: Automated Assembly Processes for High-Volume Chip Scale Packaging

摘要

The semiconductor packaging market continues to evolve as array-based packages expand their presence within end-use applications. In the past five years, more than 50 varieties of array formats have been brought to the market to meet specific end-user requirements. Figure 1 shows a roadmap of different types of packages available during the past five years [6], [1.0].