Ballast-on-a-chip: Realistic Expectation or Technical Delusion?

摘要

Integrated circuits will, in the future, play a greater role in electronic ballasts. At a panel session at the IAS 1999 Annual Meeting in Phoenix, Arizona, specialists from six leading ballast companies discussed the feasibility and suitability of silicon integration for electronic ballasts (1999 IEEE IAS Annual Meeting, Lighting Technical Sessions, Discussion Session, 6 October, Francis P. Dawson, University of Toronto, Canada, technical committee program chair). The discussion was led by Matthias Radecker, Fraunhofer-Institut IMS Duis-burg, Germany. The discussion, even if partly commercial, gave a good overview about the complex challenges in this field. Following the panelists' suggestions, in this article, we present their original statements and figures. This is not meant to be advertising but demonstrates how concepts depend on the company's philosophy. One cannot completely realize where ballast silicon integration could lead us.