The effect of intense plasma pulse pre-treatment on wettability in ceramic-copper system

摘要

The aim of the present work was to improve the wettability of ceramics such as pyrolytic graphite, glassy carbon, carbon-carbon composite and silicon carbide with liquid copper using three different processes.rnThe first process consists in applying a high intensity plasma pulse (HIPP) in deposition by pulse erosion (DPE) mode to alloy a thin (nm scale) layer of Ti into the substrate. In the second process a thicker (μm scale) layer of Ti is deposited by ArcPVD method. The third process is a sequential combination of the above processes.rnSamples were characterized by electron microscopy, X-ray fluorescence, X-ray diffraction, macroscopic photography and sessile drop tests.rnThe best results were achieved for the third process. For 70% of the tests the contact angle between Ti layer and Cu droplets was in the range 20-70°.