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Spline regression based feature extraction for semiconductor process fault detection using support vector machine

机译:基于支持向量机的基于样条回归的特征提取用于半导体工艺故障检测

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摘要

Quality control is attracting more attention in semiconductor market due to harsh competition. This paper considers Fault Detection (FD), a well-known philosophy in quality control. Conventional methods, such as non-stationary SPC chart, PCA, PLS, and Hotelling's T~2, are widely used to detect faults. However, even for identical processes, the process time differs. Missing data may hinder fault detection. Artificial intelligence (Al) techniques are used to deal with these problems. In this paper, a new fault detection method using spline regression and Support Vector Machine (SVM) is proposed. For a given process signal, spline regression is applied regarding step changing points as knot points. The coefficients multiplied to the basis of the spline function are considered as the features for the signal. SVM uses those extracted features as input variables to construct the classifier for fault detection. Numerical experiments are conducted in the case of artificial data that replicates semiconductor manufacturing signals to evaluate the performance of the proposed method.
机译:由于激烈的竞争,质量控制在半导体市场引起了越来越多的关注。本文考虑了故障检测(FD),这是质量控制领域的著名哲学。常规方法,例如非平稳SPC图,PCA,PLS和Hotelling的T〜2,被广泛用于检测故障。但是,即使对于相同的过程,处理时间也不同。数据丢失可能会阻碍故障检测。人工智能(Al)技术用于解决这些问题。提出了一种新的基于样条回归和支持向量机的故障检测方法。对于给定的过程信号,样条回归适用于将阶跃变化点作为结点。乘以样条函数基础的系数被视为信号的特征。 SVM使用这些提取的特征作为输入变量来构建用于故障检测的分类器。在人工数据的情况下进行了数值实验,该数据复制了半导体制造信号以评估所提出方法的性能。

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