New features that are continually being added to flash memory ratchet up the testing challenge another notch. The extreme variety of feature sets offered by today's flash and MCP devices and the certainty that tomorrow's memory ICs will look much different than today's put a premium on ATE flexibility and programmability. Add to this mix an incredible volume ramp with global distributions of manufacturing. All together they represent a considerable challenge to semiconductor manufacturers and their ATE partners, which, from an ATE perspective, can be addressed largely with a test-cell approach and flash-specific features.
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