Systems and software address testability

摘要

Printed-circuit-boards present significant test-and-mea-surement challenges as complexity and performance increase and components shrink. Traditional in-circuit testers and flying probers have a role to play, as do automated optical and X-ray inspection, but techniques based on boundary scan are increasingly playing a complementary role. Further, test technology engineers are extending boundary-scan derived techniques not only to look beneath LGAs and BGAs but to peer deep inside board-mounted chips. Ultimately, the domain of the circuit-board engineer extends from design capture to production test.