Meeting the Challenges in Manufacturing Known Good Die

摘要

The use of KGD provides a cost-effective means to produce fully tested memory and multichip modules. With this process, the cost of producing KGD will be less than the cost of producing packaged parts because the cost per use of the carrier is less than typical packaging costs. Bare die can be fully tested using many of the same processes used to test packaged devices. While there are challenges, there also are viable solutions available today that enable the manufacture of KGD. KGD provides unique benefits that will be critical in many new packaging applications.