DFT THAT GETS AI CHIPS TO MARKET FASTER

摘要

The semiconductor landscape is poised for the arrival of new ICs specific to the demands of AI applications. As companies race to get their chips to market, design teams are adopting DFT techniques that are better suited to the challenges of AI chips, including 1. Exploiting AI chip regularity 2. Performing DFT insertion in RTL 3. Eliminating DFT-to-test iterations These three techniques can result in significant reductions in time-to-market for large, complex AI chips.