EMI AND SIGNAL NOISE MANAGEMENT IN MINIATURE CONNECTOR AND CABLE SYSTEMS

摘要

Electronic interconnection designs for defense electronics, highly mobile robots, surgical monitoring devices and other embedded systems are rapidly changing. Signal speeds are increasing, and are often crammed into smaller and tighter spaces, and potential signal interference as well as crosstalk can become a technical issue. Instrument-level connections must contribute to ensuring electromagnetic compatibility (EMC), is achieved. EMC standards specify four levels. Level 1 includes discrete components, Level 2 is focused on circuit boards, OEM electronic products are addressed at Level 3, which includes electronic circuitry, power sources, motherboards, and interconnect systems. Cables extending beyond the enclosure should comply to Level 4, depending on the application.