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Thermal conductivity and water vapour transmission properties of wood-based materials

机译:木质材料的导热性和水蒸气透过性

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For several wood-based materials (plywood, OSB, melamine faced board (MFB), particle board and fibre board), the thermal conductivity was determined as a function of the temperature (ranging between 10 and 30 °C) and also the moisture content (from an oven-dry sample up to a moisture content at 80% RH). Furthermore, the water vapour resistance factor of these materials as well as of the coating (at MFB) and the diffusion coefficient were determined under dry cup (performance at low humidity dominated by vapour diffusion) and wet cup (performance at high humidity with liquid water and vapour transport) conditions. Thermal conductivity increases with rising temperature, moisture content and density. Moreover, a clear decrease of thermal conductivity was found with decreasing particle size at the same density level, from solid wood over plywood and particle board to fibre board. The water vapour resistance factor of the wood-based materials increases with rising density and decreases with increasing moisture content. An influence of the particle and fibre board thickness was also revealed. In contrast to the remaining materials, an increase of the water vapour resistance factor with increasing moisture content was measured for the coating. The diffusion coefficient decreases with rising density and moisture content.
机译:对于几种木质材料(胶合板,OSB,三聚氰胺饰面板(MFB),刨花板和纤维板),确定的导热系数是温度(介于10至30°C之间)和水分含量的函数(从烘干的样品中直至相对湿度在80%RH下)。此外,在干杯(在低湿度下以蒸汽扩散为主的性能)和湿杯(在高湿度下以液态水运行)下,确定了这些材料以及涂层(在MFB上)的耐水蒸气性因子和扩散系数。和蒸汽传输)条件。导热系数随着温度,水分含量和密度的升高而增加。而且,发现在相同密度水平下,从实木越过胶合板和刨花板到纤维板,随着颗粒尺寸的减小,导热系数明显降低。木质材料的耐水蒸气性系数随密度的增加而增加,而随水分含量的增加而减小。还揭示了颗粒和纤维板厚度的影响。与其余材料相反,该涂层的耐水蒸气性系数随含水量的增加而增加。扩散系数随着密度和水分含量的增加而降低。

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