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Electrochemical Deposition and Optimization of Thermoelectric Nanostructured Bismuth Telluride Thick Films

机译:热电纳米结构碲化铋厚膜的电化学沉积及优化

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摘要

Bismuth telluride thick films are suitable for thermoelectric (TE) devices covering large areas and operating at small-to-moderate temperature differences (20 - 200 K). High efficiency and high coefficient of performance (COP) are expected to be achieved by using thick films in some cooling applications. Bismuth telluride thick films fabrication have been achieved with Galvanostatic and Potentionstatic deposition. Stoichiometric bismuth telluride thick film was obtained by Galvanostatic deposition at current density of 3.1 mA·cm~(-2). Bismuth telluride films with average growth rate of 10 μm·h~(-1) and different composition were obtained. Effects of current density and composition of electrolyte in Galvanostatic deposition were studied. The current density affected the film compactness, where films deposited at lower current density were more compact than those deposited at higher current density. The morphology of the films did not depend on the current density, but chemical composition was observed when different composition of electrolyte was used. Effects of distance between electrodes, composition of electrolyte solution, and stirring in Potentionstatic deposition were studied. The shorter the distance between electrodes, the higher the electric field, thus the higher current density was applied and the deposited film was less compact. The current density increased more rapidly with stirring during electrodeposition which leads to less compact film. Through this study, films electrode-posited from solution containing 0.013 M Bi(NO_3)_3·5H_2O, 0.01 M TeO_2 and 1 M HNO_3 at 3.1 mA·cm~(-2) for 6 hours without stirring and with inter-electrode distance of 4.5 cm were free-standing with average film thickness of 60 μm and optimum film composition of Bi_2Te_3. The crystallite size of the later films was found to be around 4.3 nm using Scherrer's equation from XRD patterns. Also, negative Seebeck coefficient for the same samples was revealed with an average value of-82 μV·K~(-1).
机译:碲化铋厚膜适用于覆盖大面积且在小至中等温差(20-200 K)下工作的热电(TE)器件。通过在某些冷却应用中使用厚膜,有望实现高效率和高性能系数(COP)。碲化铋厚膜的制造已通过恒电和恒电沉积实现。通过恒电流沉积以3.1 mA·cm〜(-2)的电流密度获得化学计量的碲化铋厚膜。获得了平均生长速度为10μm·h〜(-1),组成不同的碲化铋薄膜。研究了恒电流沉积中电流密度和电解质组成的影响。电流密度影响膜的致密性,其中以较低电流密度沉积的膜比以较高电流密度沉积的膜更致密。膜的形态不取决于电流密度,但是当使用不同的电解质组成时观察到化学组成。研究了电极之间的距离,电解质溶液的组成以及搅拌对恒电位沉积的影响。电极之间的距离越短,电场越高,因此施加的电流密度越高,并且沉积膜的致密性就越差。电流密度在电沉积过程中随着搅拌而更快地增加,从而导致膜的致密性降低。通过这项研究,在3.1 mA·cm〜(-2)的条件下,从含有0.013 M Bi(NO_3)_3·5H_2O,0.01 M TeO_2和1 M HNO_3的溶液中以3.1 mA·cm〜(-2)电沉积膜6个小时,电极间距离为独立放置4.5厘米,平均薄膜厚度为60μm,最佳薄膜组成为Bi_2Te_3。根据XRD图的Scherrer方程,发现后来的薄膜的微晶尺寸约为4.3nm。另外,相同样品的塞贝克系数为负,平均值为-82μV·K〜(-1)。

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