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A Thermochemical Process Using Expanding Plasma for Nitriding Thin Molybdenum Films at Low Temperature

机译:低温下利用膨胀等离子体对钼薄膜进行氮化的热化学过程

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摘要

The mechanical and chemical properties of transition metal nitrides are very attractive for numerous industrial applications. Thin nitride films are expected to be good diffusion barrier in microelectronic devices. Nitrogen diffuses into the whole thickness of the molybdenum film heated at low temperature and exposed to expanding plasma of (Ar-N_2-H_2) compared with pure N_2 plasma. NH_X species in the plasma are produced by different homogeneous or heterogeneous reactive mechanisms that results in an expansion of the plasma compared with pure N_2 plasma. NH_X species and probably H atoms improve the transfer of nitrogen into the metal by preventing the formation of MoO_2 oxides which act as a barrier of diffusion for nitrogen.
机译:过渡金属氮化物的机械和化学性质对许多工业应用都非常有吸引力。氮化物薄膜有望在微电子器件中成为良好的扩散阻挡层。与纯N_2等离子体相比,氮扩散到低温加热的钼膜的整个厚度中,并暴露于(Ar-N_2-H_2)膨胀的等离子体中。血浆中的NH_X物质是通过不同的同质或异质反应机理产生的,与纯N_2血浆相比,该机理导致了血浆的膨胀。 NH_X物种以及可能的H原子通过阻止MoO_2氧化物的形成来改善氮向金属的转移,MoO_2氧化物充当了氮的扩散屏障。

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