A computational method for evaluating the damage in a solder joint of an electronic package subjected to thermal loads

摘要

Purpose - The purpose of this paper is to introduce a novel computational method to evaluate damage accumulation in a solder joint of an electronic package, when exposed to operating temperature environment. A procedure to implement the method is suggested, and a discussion of the method and its possible applications is provided in the paper. Design/methodology/approach - Methodologically, interpolated response surfaces based on specially designed finite element (FE) simulation runs, are employed to compute a damage metric at regular time intervals of an operating temperature profile. The developed method has been evaluated on a finite-element model of a lead-free PBGA256 package, and accumulated creep strain energy density has been chosen as damage metric. Findings - The method has proven to be two orders of magnitude more computationally efficient compared to FE simulation. A general agreement within 3 percent has been found between the results predicted with the new method, and FE simulations when tested on a number of temperature profiles from an avionic application. The solder joint temperature ranges between + 25 and +75℃. Practical implications - The method can be implemented as part of reliability assessment of electronic packages in the design phase. Originality/value - The method enables increased accuracy in thermal fatigue life prediction of solder joints. Combined with other failure mechanisms, it may contribute to the accuracy of reliability assessment of electronic packages.