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Comprehensive parametric study of using carbon foam structures saturated with PCMs in thermal management of electronic systems

机译:在电子系统的热管理中使用充满PCM的碳泡沫结构的综合参数研究

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The focus of the present work is to perform detailed parametric studies for electronic thermal management systems using different carbon foam structures of different porosities and skeleton thermal conductivities saturated with different phase change materials (PCMs) of different fusion temperatures, heat of fusions and thermal conductivities. Different thicknesses of thermal management modules and power densities levels are also included in the parametric study. The analysis was carried out using a validated finite element numerical model based on volume averaging technique and single-domain energy equation. The results show that decreasing CF and PCM thermal conductivities, increasing carbon foam porosity and increasing module height increase the module temperature and delay the approaching steady state temperature. The transient module temperature decreased and the time of approaching steady state temperature is delayed with increasing PCM heat of fusion. However the module fusion temperature does not show any strong effect on module temperature. Design guidelines for selecting the combinations of CF/PCM therrno-physical properties are presented for different operating conditions and power levels. (C) 2015 Elsevier Ltd. All rights reserved.
机译:本工作的重点是对电子热管理系统进行详细的参数研究,该系统使用具有不同孔隙率和骨架热导率的不同碳泡沫结构,并用具有不同熔化温度,熔化热和热导率的不同相变材料(PCM)饱和。参数研究还包括不同厚度的热管理模块和功率密度级别。使用基于体积平均技术和单域能量方程的经过验证的有限元数值模型进行了分析。结果表明,降低CF和PCM热导率,增加碳泡沫孔隙率和增加组件高度会增加组件温度并延迟接近稳态温度。随着PCM熔解热的增加,瞬态模块温度降低,达到稳态温度的时间延迟。但是,模块熔化温度对模块温度没有显示任何强烈影响。介绍了针对不同的工作条件和功率水平选择CF / PCM热物理性质组合的设计指南。 (C)2015 Elsevier Ltd.保留所有权利。

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