World's first wafer employing contactless testing from ST

摘要

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world's first semiconductor wafer whose dice were fully tested without con- tact probes. STs innovative advance in testing technology enables a wafer containing chips such as RFID (Radio Frequency Identification) ICs to be tested using electromagnetic waves as the sole link to the array of circuits on the wafer. Higher yields, shorter testing times and lower product cost are among the potential benefits of this approach.