首页> 外文期刊>Electronics Letters >Backgating characteristics of 0.1 mu m gate In/sub 0.3/Ga/sub 0.47/As/In/sub 0.52/Al/sub 0.48/As/InP MODFETs with Er-doped In/sub 0.52/Al/sub 0.48/As buffer layer
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Backgating characteristics of 0.1 mu m gate In/sub 0.3/Ga/sub 0.47/As/In/sub 0.52/Al/sub 0.48/As/InP MODFETs with Er-doped In/sub 0.52/Al/sub 0.48/As buffer layer

机译:0.1微米栅极In / sub 0.3 / Ga / sub 0.47 / As / In / sub 0.52 / Al / sub 0.48 / As / InP MODFET的背照特性以及掺Er In / sub 0.52 / Al / sub 0.48 / As缓冲层

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摘要

Extremely low backgating currents ( approximately 30-40 mu A) are measured in 0.1 mu m gate In/sub 0.3/Ga/sub 0.47/As/In/sub 0.52/Al/sub 0.48/As/InP MODFETs having a new buffer layer material, Er-doped In/sub 0.52/Al/sub 0.48/As, grown at 500 degrees C by MBE. Rare-earth doped GaAs and the lattice-matched ternary have resistivity approximately 10/sup 2/-10/sup 5/ Omega -cm depending on Er-doping level.
机译:在具有新缓冲层的0.1μm栅极In / sub 0.3 / Ga / sub 0.47 / As / In / sub 0.52 / Al / sub 0.48 / As / InP MODFET中测量了极低的背向电流(大约30-40μA)材料,掺Er In / sub 0.52 / Al / sub 0.48 / As,通过MBE在500摄氏度下生长。稀土掺杂的GaAs和晶格匹配的三元电阻率大约为10 / sup 2 / -10 / sup 5 / Omega -cm,具体取决于Er掺杂水平。

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