Compact 8-wavelength/spl times/2.5 Gbit/s transmitter/receiver module using PLC hybrid integration technology for WDM interconnections

摘要

A compact 8-wavelength/spl times/2.5 Gbit/s hybrid integrated transmitter/receiver module has been successfully developed, in which eight DFB-LDs/PDs are flip-chip bonded on an AWG multi/demultiplexer. It has also been confirmed that these WDM modules provide satisfactory levels of performance for realising switching systems with a 5 Tbit/s throughput using WDM interconnections.