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Mathematical analysis of GaN high electron mobility transistor false turn-on phenomenon

机译:GaN高电子迁移率晶体管虚假导通现象的数学分析

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摘要

High-power density is required in power conversion systems used in various applications, especially in electric vehicles. Driving the power devices with high frequency is one of the successful solutions to downsize a circuit's magnetic components, and hence an overall high-power density of the circuit can be realised. Therefore, GaN high electron mobility transistor (HEMT) is widely used in many applications, owing to its high-speed switching characteristics, low power losses, and high heat and radiation resistances. However, the high-speed switching of GaN HEMT comes with a drawback. For instance, in a full-bridge inverter configuration, high-speed turn-on of one device may cause a false turn-on of the complementary device. If a power device has encountered a false turn-on, the GaN HEMT devices will suffer from overcurrent, excessive heat and is eventually destructed due to the short circuit. This phenomenon can be tackled by modifying the circuit conditions. In this Letter, the theoretical analysis of a three-phase full-bridge inverter is developed to figure out the behaviour of the GaN HEMT gate voltage, which is the key-factor parameter causing a false turn-on. On the basis of the proposed theoretical analysis, the circuit conditions which minimise the gate voltage spike are derived.
机译:在各种应用中使用的功率转换系统中,特别是在电动汽车中,需要高功率密度。高频驱动功率器件是减小电路磁性元件尺寸的成功解决方案之一,因此可以实现电路的整体高功率密度。因此,由于GaN高电子迁移率晶体管(HEMT)的高速开关特性,低功率损耗以及高耐热性和抗辐射性,被广泛用于许多应用中。但是,GaN HEMT的高速开关具有缺点。例如,在全桥逆变器配置中,一个设备的高速开启可能会导致互补设备的错误开启。如果功率器件遇到错误的导通,则GaN HEMT器件将遭受过电流,过热并最终因短路而损坏。这种现象可以通过修改电路条件来解决。在这封信中,对三相全桥逆变器进行了理论分析,以找出GaN HEMT栅极电压的行为,这是导致错误导通的关键因素。在提出的理论分析的基础上,得出了使栅极电压尖峰最小的电路条件。

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