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Uniform shallow trenches termination design for high-voltage VDMOS transistor

机译:高压VDMOS晶体管的均匀浅沟槽终端设计

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A new uniform shallow trenches termination (ST2) with field plate for high-voltage VDMOS transistor is proposed in this Letter. In ST2 structure, the electric field near the source is decreased and the depletion region is extended by the field plate, besides, many electric field peaks are introduced in shallow trenches under the field plate and the average electric field strength is increased, both improve the characteristic of the breakdown voltage (BV). Simulation results show the BV of ST2 VDMOS is 706 V with a termination length L-d = 132 mu m, which reaches 97% of that of the parallel-plane junction, and the influence of the edge curvature effect is almost entirely eliminated. The ST2 structure is compatible with conventional CMOS process with only one additional mask and its fabrication is low-cost.
机译:在这封信中提出了一种新的均匀浅沟槽终端(ST2),具有高压VDMOS晶体管的场板。在ST2结构中,源附近的电场减小,并且耗尽区由场板延伸,此外,在场板下方的浅沟槽中引入了许多电场峰值,并且平均电场强度增加,两者都改善了击穿电压(BV)的特征。仿真结果表明,ST2 VDMOS的BV是706V,终端长度L-D =132μm,其达到平行面结的97%,并且几乎完全消除了边缘曲率效应的影响。 ST2结构与传统的CMOS工艺兼容,只有一个额外的掩模,其制造是低成本。

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