Is it possible to say anything new about designing ac-dc supplies? Frank Rene, president of global product development at XP Power, sent along a list of five incremental enhancements that added up for his company. First, solder power semiconductors directly to the pc board and then bond them to the chassis, rather than insulating them and bolting them to the chassis. Countering the expense of thermal bonding materials, assembly costs go down. This also reduces the size of the supply and reduces device junction temperatures by about 10℃, roughly doubling expected mean-time before failure (MTBF).
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机译：关于设计交流-直流电源，有什么新的说法吗？ XP Power全球产品开发总裁Frank Rene发了一份清单，列出了五个增量增强功能，这些增强功能为其公司加起来了。首先，将功率半导体直接焊接到印刷电路板上，然后将它们粘合到机箱上，而不是绝缘并用螺栓将它们固定到机箱上。抵消热粘合材料的费用，装配成本下降了。这也减小了电源尺寸，并使器件结温降低了约10℃，大约是预期的平均故障前时间（MTBF）的两倍。
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