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A semiconductor YBaCuO microbolometer for room temperature IR imaging

机译:用于室温红外成像的半导体YBaCuO微辐射热计

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摘要

The characteristics of infrared (IR) microbolometer arrays utilizing semiconducting YBaCuO and operating at room temperature are presented. Surface-micromachined structures in the form of 1/spl times/10 arrays of pixel size 40 /spl mu/m/spl times/40 /spl mu/m and 60 /spl mu/m/spl times/60 /spl mu/m as well as single pixels of various geometries were constructed. Using the chopped radiation from a broad-band IR source, the responsivity R/sub V/ of the sensor was measured to be as high as 10/sup 4/ V/W and detectivity D* to be /spl sim/2/spl times/10/sup 7/ cm Hz/sup 1/2//W for a thermal conductance G/spl sim/10/sup -5/ W/K between the detector and the substrate. The spectral response was found to be uniform over a range of 1-12 /spl mu/m. Silicon micromachining and ambient-temperature processing were employed to ensure compatibility and, therefore, potential integration with CMOS-based signal processing circuitry. Methods of enhancing the figures of merit are discussed.
机译:介绍了利用半导体YBaCuO并在室温下工作的红外(IR)微辐射热计阵列的特性。表面微加工结构,其形式为像素大小为40 / spl mu / m / spl times / 40 / spl mu / m和60 / spl mu / m / spl times / 60 / spl mu /构造了m以及各种几何形状的单个像素。使用来自宽带红外源的斩波辐射,测得传感器的响应度R / sub V /高达10 / sup 4 / V / W,检测度D *达到/ spl sim / 2 / spl检测器和基板之间的热导率G / spl sim / 10 / sup -5 / W / K的10次/ sup 7 / cm Hz / sup 1/2 // W。发现光谱响应在1-12 / spl mu / m的范围内是均匀的。采用硅微机械加工和环境温度处理来确保兼容性,并因此确保与基于CMOS的信号处理电路的潜在集成。讨论了提高品质因数的方法。

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