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Gate All Around MOSFET With Vacuum Gate Dielectric for Improved Hot Carrier Reliability and RF Performance

机译:利用真空栅极电介质对MOSFET进行全栅栅极化,以改善热载流子的可靠性和RF性能

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摘要

In this paper, gate all around (GAA) MOSFET with vacuum gate dielectric is proposed for the first time for improved hot carrier reliability and RF performance. Analog and RF performance of the GAA MOSFET with vacuum gate dielectric (GAA VacuFET) is compared with conventional GAA MOSFET with ${rm SiO}_{2}$ dielectric, and it is found that GAA VacuFET is superior to ${rm SiO}_{2}$ dielectric for RF high-speed applications and more immune to the hot carrier damage because of low electric field at the drain side but it has a serious drawback of low on-current and transconductance as compared to ${rm SiO}_{2}$ dielectric. In order to enhance the on current and transconductance of GAA VacuFET, Gate Electrode engineering and channel doping engineering are used. An analytical model is developed for dual material gate graded channel GAA MOSFET with vacuum gate dielectric (DMG GC VacuFET) and the model is verified with the simulated results. Incorporation of DMG and GC not only enhances digital and analog RF performance of GAA VacuFET but also hot carrier reliability is improved.
机译:本文首次提出了具有真空栅极电介质的全栅(GAA)MOSFET,以提高热载流子的可靠性和RF性能。将具有真空栅极电介质(GAA VacuFET)的GAA MOSFET的模拟和RF性能与具有 $ {rm SiO} _ {2} $ < / tex> 电介质,发现GAA VacuFET优于 $ {rm SiO} _ {2} $ < / formula>用于RF高速应用的电介质,并且由于漏极侧的低电场而更不受热载流子损坏的影响,但是与 $ {rm SiO} _ {2} $ 电介质。为了增强GAA VacuFET的导通电流和跨导,使用了栅极电极工程和沟道掺杂工程。针对具有真空栅极电介质(DMG GC VacuFET)的双材料栅极渐变沟道GAA MOSFET建立了解析模型,并通过仿真结果验证了该模型。 DMG和GC的结合不仅可以增强GAA VacuFET的数字和模拟RF性能,而且可以提高热载流子的可靠性。

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