首页> 外文期刊>Electron Devices, IEEE Transactions on >Atomistic Modeling of Pocket Dopant Deactivation and Its Impact on $V_{textrm {th}}$ Variation in Scaled Si Planar Devices Using an Atomistic Kinetic Monte Carlo Approach
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Atomistic Modeling of Pocket Dopant Deactivation and Its Impact on $V_{textrm {th}}$ Variation in Scaled Si Planar Devices Using an Atomistic Kinetic Monte Carlo Approach

机译:口袋型掺杂物失活的原子建模及其对 $ V_ {textrm {th}} $ 尺度Si变化的影响使用原子动力学蒙特卡洛方法的平面装置

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摘要

An analysis of pocket dopant deactivation and its impact on variation for scaled Si devices using an atomistic kinetic Monte Carlo approach are shown in this paper. B 5 keV, /cm As 1 keV, /cm implants were used for B pocket deactivation study. An effect of laser annealing (LA) before spike-Rapid Thermal Annealing (RTA) was investigated. In case of B pocket implant, a stable B cluster configuration is changed from (>1020 °C) to BI at spike-RTA temperature . BI is a source of B pocket deactivation with lower temperature than 1020 °C. LA before low-temperature spike-RTA (<1020 °C) is useful to improve B pocket activation. The mismatch figure of merit extracted from Pelgrom plot (Avt) degradation in nFET is shown as spike-RTA temperature is reduced. LA before spike-RTA shows a better short channel effect with lower drain-induced barrier lowering in nFET. LA + spike-RTA at 1000 °C shows better Avt than spike-RTA-only. The difference of pocket deactivation is one of possible important reasons fo- the higher mismatch for nFET than for pFET.
机译:本文展示了使用原子动力学蒙特卡洛方法分析袋装掺杂剂失活及其对定标硅器件变化的影响。 B 5 keV / cm作为1 keV / cm植入物用于B袋失活研究。研究了尖峰快速热退火(RTA)之前的激光退火(LA)的影响。如果是B型口袋植入物,则在尖峰-RTA温度下,稳定的B簇构型将从(> 1020°C)变为BI。 BI是温度低于1020°C的B袋失活的来源。低温尖峰-RTA(<1020°C)之前的LA有助于改善B腔的活化。从nFET中的Pelgrom图(Avt)降级中提取的品质因数失配显示为降低了尖峰-RTA温度。尖峰-RTA之前的LA表现出更好的短沟道效应,并且在nFET中较低的漏极诱导势垒降低。 LA +尖峰-RTA在1000°C下的平均伏安值比纯尖峰-RTA更好。口袋失活的差异是nFET的失配比pFET的失配更高的可能重要原因之一。

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