Theoretical Prediction of High-Performance Room-Temperature InGaAs/Si Single-Photon Avalanche Diode Fabricated by Semiconductor Interlayer Bonding

摘要

Single-photon avalanche diode (SPAD) is an ultrasensitive device for the detection of weak signals. Epitaxial InP-based devices exhibit poor avalanche characteristics and poor compatibility with Si complementary metal oxide semiconductor (CMOS) circuit, and epitaxial Si-based devices show high dark count rate (DCR) and limited detection wavelength. Here we first show a new generation of InGaAs-on-Si SPADs, achieved by semiconductor interlayer bonding, for the detection of 1550-nm infrared signals theoretically. This wafer-bonded InGaAs/Si SPAD has enabled a significant step-change in performance. The dark current of this SPAD is four orders of magnitude lower than that of the epitaxial ones (300 K). High gain-bandwidth-product of 254 and 353 GHz is achieved at the gain of similar to 24 and similar to 36, respectively, for the wafer-bonded SPAD with polycrystalline Si bonding layer at InGaAs/Si bonded interface. In comparison with epitaxial SPADs, the wafer-bonded ones exhibit low DCR (similar to 10(5) Hz at 10% V-br), high single photon detection efficiency (similar to 24% at 10% V-br), and high pulse repetition rate (1 GHz at 5% V-br) at 300 K. These results indicate that utilizing the wafer-bonded platform, the route toward high-performance InGaAs-on-Si SPAD arrays for use in future eye-safe laser radar (LIDAR) and quantum communication at room temperature (RT) is expected to be achieved.