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Assessment of THz Performance for a Lateral SiGe HBT on SOI With a Laterally Graded Base

机译:评估具有横向渐变基底的SOI上横向SiGe HBT的THz性能

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摘要

This paper presents a simulation-based assessment of the design, characteristics, and feasibility of a lateral SiGe heterojunction bipolar transistor with a graded base on a silicon on insulator. A device was created with a focus on integration with the CMOS process, THz fT/fmax, and low-power dissipation. These characteristics are achieved with an ultrathin base width of 22 nm, grading of the base, and modification of standard doping profiles. In TCAD simulations, the n-p-n device has a unity gain cutoff frequency (fT) of 1.2 THz and maximum oscillation frequency (fmax) of 2 THz. The p-n-p of the same design has fTof 900 GHz and fmaxof 1.8 THz. Additional Monte Carlo plots that show electron velocity and carrier densities across the length of the device, and a discussion on ballistic effects in the proposed devices are presented. To demonstrate the feasibility of the device, a possible process flow for fabrication is also summarized.
机译:本文提出了一种基于仿真的评估,对绝缘体上的硅具有渐变基的横向SiGe异质结双极型晶体管的设计,特性和可行性进行了评估。创建了一个专注于与CMOS工艺集成的设备,THz f n T n / f n max n,并且功耗低。这些特性是通过22nm的超薄基极宽度,基体分级和标准掺杂分布的修改实现的。在TCAD仿真中,npn设备具有单位增益截止频率(f n T)为1.2 THz,最大振荡频率(f n max n)为2 THz。相同设计的pnp具有f n T n of 900 GHz和f n maxof 1.8 THz。另外的蒙特卡洛图显示了整个器件长度上的电子速度和载流子密度,并提出了对所提出器件中弹道效应的讨论。为了证明该装置的可行性,还总结了可能的制造工艺流程。

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