机译:p-InGaN层的厚度对具有p-GaN / InGaN异质结的GaN基LED的器件物理和材料质量的影响
State Key Laboratory of Luminescent Materials and Devices, Guangzhou, China;
State Key Laboratory of Luminescent Materials and Devices, Guangzhou, China;
Chemistry and Chemical Engineering School, Lanzhou University, Lanzhou, China;
Choicore Optoelectronics Company Ltd., Heyuan, China.;
State Key Laboratory of Luminescent Materials and Devices, Guangzhou, China;
Engineering Research Center on Solid-State Lighting and its Informationisation of Guangdong Province, South China University of Technology, Guangzhou, China;
Light emitting diodes; Heterojunctions; Quantum well devices; Physics; Charge carrier processes; Resistance; Epitaxial growth;
机译:通过更改p-InGaN覆盖层的厚度来改善p-GaN膜上的Ni非合金欧姆接触
机译:P-GaN / Ingan异质结的新结构,增强蓝GAN的LED孔注射
机译:Ni / Au与p-GaN之间的接触电阻率很低,这是通过掺杂Mg的薄p-GaN和p-InGaN化合物接触层实现的
机译:使用p-InGaN和p-InGaN / p-GaN超晶格作为p型层的InGaN MQW绿色LED
机译:利用纳米技术在Si上生长,制造和表征基于InGaN / GaN的蓝色,绿色和黄色LED。
机译:氮掺杂对TiO2基固态染料敏化太阳能电池器件操作的影响:从材料到器件的光物理
机译:p-GaN退火对GaN基LED晶圆和器件性能的影响
机译:用于alxGa(1-x)as / Gaas mOsFET和相关异质结器件的Gaas和p + Gaas层的半导体器件处理蚀刻剂溶液的表征