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首页> 外文期刊>IEEE Electron Device Letters >Enhanced off-state leakage currents in n-channel MOSFETs with N/sub 2/O-grown gate dielectric
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Enhanced off-state leakage currents in n-channel MOSFETs with N/sub 2/O-grown gate dielectric

机译:具有N / sub 2 / O生长的栅极电介质的n沟道MOSFET增强了关态漏电流

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摘要

This paper reports on the off-state drain (GIDL) and gate current (Ig) characteristics of n-channel MOSFETs using thin thermal oxide (OX), N/sub 2/O-nitrided oxide (N2ON), and N/sub 2/O-grown oxide (N20G) as gate dielectrics. Important phenomena observed in N20G devices are enhanced GIDL and Ig in the low-field region as compared to the OX and N20N devices. They are attributed to heavy-nitridation-induced junction leakage and shallow-electron-trap-assisted tunneling mechanisms, respectively. Therefore, N2ON oxide is superior to N20G oxide in leakage-sensitive applications.
机译:本文报告了使用薄热氧化物(OX),N / sub 2 / O氮化氧化物(N2ON)和N / sub 2的n沟道MOSFET的关态漏极(GIDL)和栅极电流(Ig)特性/ O生长的氧化物(N20G)作为栅极电介质。与OX和N20N器件相比,在N20G器件中观察到的重要现象是低场区的GIDL和Ig增强。它们分别归因于重氮化引起的结泄漏和浅电子陷阱辅助隧穿机制。因此,在对泄漏敏感的应用中,N2ON氧化物优于N20G氧化物。

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