首页> 外文期刊>IEEE Electron Device Letters >An Air Spacer Technology for Improving Short-Channel Immunity of MOSFETs With Raised Source/Drain and High-k Gate Dielectric
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An Air Spacer Technology for Improving Short-Channel Immunity of MOSFETs With Raised Source/Drain and High-k Gate Dielectric

机译:空气隔离器技术可通过提高源极/漏极和高k栅极电介质来提高MOSFET的短沟道抗扰度

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摘要

An air-spacer technology with raised source/drain (S/D) for ultrathin-body (UTB) silicon-on-insultor MOSFETs is developed. The results show that the poly raised S/D can effectively reduce the series resistance and the air spacer can effectively reduce the fringing capacitance. The air spacer is particularly useful when combined with high-k gate dielectric. The improved device characteristics are demonstrated experimentally and by extensive two-dimensional device simulation.
机译:开发了一种用于高绝缘体上硅MOSFET的具有高源漏(S / D)的空气间隔器技术。结果表明,多晶硅凸起的S / D可以有效降低串联电阻,而空气垫片可以有效降低边缘电容。当与高k栅极电介质结合使用时,空气隔离器特别有用。改进的器件特性通过实验和广泛的二维器件仿真得到了证明。

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