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首页> 外文期刊>IEEE Electron Device Letters >High-Performance Single Polysilicon EEPROM With Stacked MIM Capacitor
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High-Performance Single Polysilicon EEPROM With Stacked MIM Capacitor

机译:具有堆叠MIM电容器的高性能单多晶硅EEPROM

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High-performance single polysilicon electrically erasable programmable read-only memories (EEPROMs) with stacked metal-insulator-metal capacitor as a control gate are investigated. The thickness of the tunnel oxide and the length of the floating gate channel of the fabricated devices were 52 A and 0.24 μm, respectively. The effective control gate coupling ratio of the proposed EEPROM cell was higher than that of cells with n-well control gate because of the absence of depletion capacitance in the n-well silicon region. The experimental results showed that the program speed of the proposed cells were faster than those of the conventional n-well control gate cells. In addition, the proposed cells had threshold voltage shifts of 3.5 V between program and erase states. Furthermore, there were threshold voltage shifts of 3.0 V without degradation of the read currents after 1000 program/erase cycles.
机译:研究了以堆叠的金属-绝缘体-金属电容器作为控制栅极的高性能单多晶硅电可擦可编程只读存储器(EEPROM)。所制造的器件的隧道氧化物的厚度和浮栅沟道的长度分别为52 A和0.24μm。所提出的EEPROM单元的有效控制栅极耦合比高于具有n阱控制栅极的单元,因为在n阱硅区域中没有耗尽电容。实验结果表明,所提出的单元的编程速度比常规的n阱控制栅单元要快。另外,所提出的单元在编程状态与擦除状态之间具有3.5V的阈值电压偏移。此外,经过1000个编程/擦除周期后,阈值电压漂移为3.0 V,而读取电流却没有下降。

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