${rm HfO}_{2}/{rm Si}_{3}{rm N}_{4}({rm HN})$ stacked trapping lay'/> Improved Erasing Speed in Junctionless Flash Memory Device by ${rm HfO}_{2}/{rm Si}_{3}{rm N}_{4}$ Stacked Trapping Layer
首页> 外文期刊>IEEE Electron Device Letters >Improved Erasing Speed in Junctionless Flash Memory Device by ${rm HfO}_{2}/{rm Si}_{3}{rm N}_{4}$ Stacked Trapping Layer
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Improved Erasing Speed in Junctionless Flash Memory Device by ${rm HfO}_{2}/{rm Si}_{3}{rm N}_{4}$ Stacked Trapping Layer

机译:通过$ {rm HfO} _ {2} / {rm Si} _ {3} {rm N} _ {4} $堆叠陷阱层提高了无结闪存设备的擦除速度

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摘要

A junctionless (JL) polycrystalline-based flash memory device with ${rm HfO}_{2}/{rm Si}_{3}{rm N}_{4}({rm HN})$ stacked trapping layer is studied for the first time. Effects of the HN stacked trapping layer on JL and inversion-mode (IM) flash devices are compared. JL device shows faster programming speed than the IM one because of its heavily doped n-channel. Specially, comparable erasing speed of JL device can be achieved by HN stacked trapping layer due to more effective electron detrapping. JL device with HN stacked trapping layer also shows better retention characteristics and keeps a larger window after $10^{5}$ programming/erasing cycles, which makes it promising for 3-D memory integration in the future.
机译:一种基于非结(JL)多晶硅的闪存设备,其 $ {rm HfO} _ {2} / {rm Si} _ {3} {rm N}首次研究了_ {4}({rm HN})$ 堆叠陷阱层。比较了HN堆叠陷阱层对JL和反转模式(IM)闪存设备的影响。 JL器件显示出比IM器件更快的编程速度,因为它的n沟道掺杂很重。特别地,由于更有效的电子去俘获,通过HN堆叠的俘获层可以实现可比较的JL器件的擦除速度。带有HN堆叠捕获层的JL器件在 $ 10 ^ {5} $ 编程/之后,还显示出更好的保留特性并保持更大的窗口/擦除周期,这使它有希望在将来进行3D内存集成。

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