University-research consortium SRC {Semiconductor Research Corp) and researchers from Stanford University claim to have developed a combination of elements that yields a unique nanostructure material for packaging that they say offers longer device life for less cost than current solder methods. The partners note that current solder materials tend to degrade and fail due to heat and mechanical stress. Focusing on contin-
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机译:大学研究联盟SRC(Semiconductor Research Corp)和斯坦福大学的研究人员声称已开发出多种元素的组合,这些元素可产生用于包装的独特纳米结构材料,他们说,与目前的焊接方法相比,该器件可提供更长的器件寿命且成本更低。合作伙伴指出,当前的焊接材料会因热量和机械应力而降解并失效。专注于持续
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