Radiofrequency circuit-design based on multi-layer hybrid, technology

摘要

The continuous miniaturization-process of wireless communication products requires more and more specific design- and simulation methods. Design engineers have to find the right trade-off between miniaturization and functional performance regarding production influences. For the realization of radio- frequency and microwave circuits the multi-layer hybrid technology has been recently applied and is about to expand to further application fields. Utilizing e.g. low temperature co-fired ceramics (LTCC) up to 30 metallization layers is state of the art. The design of such circuits can be accelerated essentially by applying EM analysis methods.