Integration solutions for reconfigurable multi-standard wireless transceivers

摘要

AbstractThis article presents an overview of modern integration concepts for receiver, transmitter and duplexer architectures. Based on innovative design techniques, a system-in-package integrated RF transceiver architecture is proposed as a low-cost low-power alternative to traditional multi-standard transceivers. The proposed transceiver architecture unites advantages of a sub-sampling receiver with tunable low noise amplifier (LNA), a high-efficiency digital power amplifier and an integrated duplexer with on-package passive components in order to fulfill the more and more stringent requirements for wireless systems. In addition to the transceiver architecture, measurement results of building blocks are presented. A LNA circuit implemented in65nm$65~text{nm}$CMOS technology provides a continuously tunable-gain (3–23 dB) and a tunable frequency band (4.5 GHz–5.5 GHz) with noise figure of2dB$2~text{dB}$and IIP3of−6.5dBm$-6.5~text{dBm}$at the highest gain. A high Q-factor, on-package transformer, implemented in a core-less 3-metal layer system-in-package substrate, presents a coupling factor of 0.6 and a Q-factor of approximately 30. This provides a low-cost, high-performance alternative solution to integrated matching networks and duplexers.