Thin-film thermoelectric modules offer higher cooling capacity

摘要

Nextreme Thermal Solutions announced a new series of thin-film thermoelectric modules that offer high cooling capacity, robust mechanical design and source-matched heat flux density for easier integration into existing electronic systems. At 1.1mm high, the new eTEC MA8000 Series is designed to provide low-profile thermal management solutions for medium heat flux applications in photonics, electronics, and aerospace markets. The MA8000 series includes five new modules that can pump from 10 W to over 80 W of heat at an ambient temperature of 25℃ with footprints ranging from 63 mm2 to 375 mm~2. With heat flux densities ranging from 16 W/cm~2 to 22 W/cm~2, the MA Series offers the ability to match thermoelectric cooling designs more easily to heat sources and existing convection-based heat rejection systems.