首页> 外文期刊>International Journal of Polymer Science >High-Density Polyethylene Composites Filled with Nanosilica Containing Immobilized Nanosilver or Nanocopper: Thermal, Mechanical, and Bactericidal Properties and Morphology and Interphase Characterization
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High-Density Polyethylene Composites Filled with Nanosilica Containing Immobilized Nanosilver or Nanocopper: Thermal, Mechanical, and Bactericidal Properties and Morphology and Interphase Characterization

机译:包含固定化纳米银或纳米铜的纳米二氧化硅的高密度聚乙烯复合材料:热,机械和杀菌性能以及形态和相间表征

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摘要

Silica containing immobilized nanosilver (Ag-SiO2) or nanocopper (Cu-SiO2) was used as a filler for high-density polyethylene (HDPE). The HDPE/Ag-SiO2and HDPE/Cu-SiO2composites were prepared by melt blending and injection molding. The microstructure of the composites was examined using transmission electron microscopy (TEM). The crystallization behavior and thermal properties were studied using differential scanning calorimetry (DSC) and thermogravimetry (TGA). The mechanical properties were characterized by tensile, flexural, and impact tests as well as dynamic mechanical thermal analysis (DMTA). The ability of silica to give antimicrobial activity to HDPE was also investigated and discussed. The TEM images indicate that Ag-SiO2show lower degree of agglomeration than Cu-SiO2nanoparticles. The crystallization temperature increased, whereas crystallinity decreased in the composites. The thermal stability of the composites was significantly better compared to HDPE. Improved stiffness indicating very good interfacial adhesion was observed. Excellent activity against different kinds of bacteria was found.
机译:包含固定化纳米银(Ag-SiO2)或纳米铜(Cu-SiO2)的二氧化硅用作高密度聚乙烯(HDPE)的填料。 HDPE / Ag-SiO2和HDPE / Cu-SiO2复合材料是通过熔融共混和注塑成型制备的。使用透射电子显微镜(TEM)检查复合材料的微观结构。使用差示扫描量热法(DSC)和热重分析法(TGA)研究了结晶行为和热性能。机械性能通过拉伸,弯曲和冲击测试以及动态机械热分析(DMTA)进行表征。还研究了二氧化硅赋予HDPE抗菌活性的能力。 TEM图像表明,Ag-SiO2的团聚度低于Cu-SiO2纳米粒子。复合材料的结晶温度升高,而结晶度降低。与HDPE相比,复合材料的热稳定性明显更好。观察到刚度改善,表明界面粘合性非常好。发现了对各种细菌的优异活性。

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