Computational fluid dynamic (CFD) techniques have been successfully applied to the realm of electronics cooling applications for about 20 years. Despite the powerful advances in solver techniques, parallelization, computer hardware, and ECAD and MCAD interfacing, CFD can still provide only snapshots of the thermal performance in a product. Usually this comes in the form of pictures or animations that display what the temperature field looks like at various locations in the model. This is useful information, of course, because it allows thermal engineers to confirm thermal compliance without building numerous expensive prototypes. Yet the question of what to do next still remains.
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