机译:Ag参与96.5Sn-3Ag-0.5Cu合金电化学迁移的证据
Southwest Petr Univ, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Sichuan, Peoples R China;
Max Planck Inst Eisenforsch GmbH, Max Planck St 1, D-40237 Dusseldorf, Germany;
Hong Kong Polytech Univ, Interdisciplinary Div Aeronaut & Aviat Engn, Hung Horn, Kowloon, Hong Kong 999077, Peoples R China;
Budapest Univ Technol & Econ, Dept Elect Technol, H-1111 Budapest, Hungary;
Southwest Petr Univ, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Sichuan, Peoples R China;
Southwest Petr Univ, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Sichuan, Peoples R China;
Southwest Petr Univ, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Sichuan, Peoples R China;
Southwest Petr Univ, State Key Lab Oil & Gas Reservoir Geol & Exploita, Chengdu 610500, Sichuan, Peoples R China;
Tin; STEM; Anodic dissolution;
机译:在热迁移应力下,96.5秒-3Ag-0.5Cu / TiC复合焊料的微观结构,组成和硬度演进
机译:锡原子热迁移到96.5Sn-3Ag-0.5Cu倒装芯片焊点热端的原位观察
机译:具有Au / Ni / Cu或Cu衬底焊盘金属化的96.5Sn-3Ag-0.5Cu倒装芯片焊点的电迁移可靠性
机译:在Au / Ni / Cu / Cu或Cu金属的基材垫上粘合在96.5sn-3ag-0.5cu倒装芯片焊盘上的电迁移
机译:微弧氧化涂层镁合金的电化学行为
机译:电化学方法对铸造AZ91镁合金评估的比较
机译:Sn和Sn焊料合金的电化学迁移:综述