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Gigabit signals demand higher speed and higher density mezzanine connectors

机译:千兆信号需要更高的速度和更高的夹层连接器

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摘要

Currently, digital signal speeds on PCBs are moving up to 5 Gbit/s, and signal speeds of up to 10 Gbit/s are expected to get into the designs the next few years. These trends are driving the need for enhanced backplane and mezzanine connector technologies to meet the signal-integrity requirements of these systems. The dramatic increase in bandwidth has impacted connector performance in terms of capacitance, crosstalk, impedance, inductance, and reflection. Several industry standards have bus structures based on high-speed lanes, or channels, using 2.5 to 3.187 Gbits/s per lane. These include 10G Ethernet (IEEE 802.3ak - CX4), InfiniBand, 10G Fibre Channel, Serial Attached SCSI (SAS), and Serial ATA2 (SATA-2). Consequendy, systems need high-performance connectors that not only meet higher electrical specifications, but also meet high-density requirements.
机译:当前,PCB上的数字信号速度正在提高到5 Gbit / s,预计在未来几年内将达到10 Gbit / s的信号速度。这些趋势推动了对增强背板和夹层连接器技术的需求,以满足这些系统的信号完整性要求。带宽的急剧增加已经影响了连接器的电容,串扰,阻抗,电感和反射性能。几种行业标准具有基于高速通道或通道的总线结构,每个通道使用2.5至3.187 Gbit / s。其中包括10G以太网(IEEE 802.3ak-CX4),InfiniBand,10G光纤通道,串行连接的SCSI(SAS)和串行ATA2(SATA-2)。因此,系统需要高性能的连接器,这些连接器不仅要满足更高的电气规格,还要满足高密度要求。

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