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首页> 外文期刊>Composites Science and Technology >Static and fatigue failure analysis of adhesively bonded thick composite single lap joints
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Static and fatigue failure analysis of adhesively bonded thick composite single lap joints

机译:黏结厚复合单搭接接头的静疲劳破坏分析

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摘要

Static and fatigue behavior of thick composite laminate single lap joints with thick adhesive bondline is experimentally and numerically investigated. Stress based analysis is used to understand the uniaxial tensile behavior of thick glass fiber reinforced epoxy laminates bonded with relatively thick epoxy adhesive. The effect of adhesive thickness on relatively thick adherend on the fatigue initiation life was modeled with generalized stress singularity approach. It was observed that the failure onset always occurred at adherend-adhesive interface. Subsequent crack propagation mostly resulted in interlaminar failure of adjacent first angle ply near to this interface. Both static and fatigue strength values decrease with increase of bondline thickness. Evaluation of generalized stress intensity factors of the corner geometry (square edge joint) provided a good correlation between predictions and experimental measurements.
机译:通过实验和数值研究了具有厚胶粘剂的厚复合层压板单搭接接头的静态和疲劳行为。基于应力的分析用于了解用相对较厚的环氧胶粘剂粘结的较厚的玻璃纤维增​​强环氧层压板的单轴拉伸性能。用广义应力奇异性方法模拟了粘合剂厚度对相对厚的被粘物对疲劳起始寿命的影响。观察到失效开始总是发生在被粘物-粘合剂界面上。随后的裂纹扩展主要导致靠近该界面的相邻第一角帘布层的层间破坏。静态强度和疲劳强度值都随着粘合线厚度的增加而降低。角部几何形状(方形边缝)的广义应力强度因子的评估在预测和实验测量之间提供了良好的相关性。

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  • 来源
    《Composites Science and Technology》 |2013年第9期|18-25|共8页
  • 作者单位

    School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;

    School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore,Energy Research Institute @ NTU, 1 CleanTech Loop, Singapore 637141, Singapore;

    Energy Research Institute @ NTU, 1 CleanTech Loop, Singapore 637141, Singapore;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A. Adhesive joints; B. Fatigue; B. Interface; C. Finite element analysis;

    机译:A.胶接点;B.疲劳;B.接口;C.有限元分析;

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