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An analytical solution for the morphological evolution of a hole in the interconnect embedded in matrix

机译:嵌入矩阵的互连中孔的形态演化的解析解

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摘要

An orthotropic model for the morphological evolution of a hole in representative interconnection lines embedded in a matrix with different line aspect (volume) ratio, under mechanical loadings, is established. The thermodynamics potential of the morphological evolution of a hole in the orthotropic model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the hole in the orthotropic model are described, which gives some insight into the reliability of the representative interconnect embedded in a matrix under mechanical loading.
机译:建立了一种正交各向异性模型,该模型用于在机械载荷下嵌入具有不同线宽(体积)比的矩阵中的代表性互连线中孔的形态演化。基于能量原理,给出了正交各向异性模型中孔的形态演化的热力学潜力。因此,描述了正交异性模型中孔的形态演化的路径和分叉条件,这使人们对机械负载下嵌入矩阵中的代表性互连的可靠性有了一定的了解。

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  • 来源
    《Composites 》 |2010年第8期| p.608-612| 共5页
  • 作者

    S. Li; X. Wang; H. Wang; Z. Li;

  • 作者单位

    School of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai jiaotong University, Shanghai 200240, PR China;

    rnSchool of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai jiaotong University, Shanghai 200240, PR China;

    rnSchool of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai jiaotong University, Shanghai 200240, PR China;

    rnSchool of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai jiaotong University, Shanghai 200240, PR China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A.Thin films; B. Defects; B. Microstructures; C. Analytical modeling;

    机译:A.薄膜B.缺陷;B.微观结构;C.分析模型;

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