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Thermal buckling and free vibration of composite sandwich curved panels

机译:复合三明治弯板的热屈曲和自由振动

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摘要

For this article, the thermal buckling and free vibration of Composite Sandwich Curved Panels (CSCP) in a thermal environment are analyzed. To achieve the purposes, Hamilton's principle is used to deduce the non-linear vibration differential equations of CSCP based on the first-order discrete layer model. In these equations, nonlinear change of lateral and longitudinal displacements are taken into account because of the temperature change. Later, these equations are solved by the Navier method and are authenticated by comparison with finite element simulation results. At last, the influence rules of structural parameters on Critical Buckling Temperature (CBT) of CSCP are studied and exhibited vividly. Meanwhile, some new results about thermal buckling and free vibration of CSCP are presented for the first time.
机译:对于本文,分析了热环境中复合夹层弯曲板(CSCP)的热屈曲和自由振动。 为了实现目的,汉密尔顿的原理用于基于一阶离散层模型推断CSCP的非线性振动微分方程。 在这些方程中,由于温度变化,考虑了横向和纵向位移的非线性变化。 稍后,这些方程由Navier方法解决,并通过与有限元模拟结果进行比较进行认证。 最后,研究了CSCP关键屈曲温度(CBT)的结构参数的影响规则,生动地展出。 同时,首次提出了关于CSCP的热屈曲和自由振动的一些新结果。

著录项

  • 来源
    《Composite Structures》 |2021年第7期|113869.1-113869.13|共13页
  • 作者单位

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China;

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China;

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China;

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China;

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China|Qingdao Univ Technol Sch Mech Engn Qingdao 266520 Peoples R China;

    Weifang Univ Sci & Technol Facil Hort Lab Univ Shandong Weifang 262700 Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Critical buckling temperature; Composite sandwich Curved Panels; Free vibration; Thermal buckling;

    机译:关键屈曲温度;复合夹层弯曲面板;自由振动;热屈曲;

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