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Buckling and debond growth of partial debonds in adhesively bonded composite splice joints

机译:粘接复合拼接接头中部分脱胶的屈曲和脱胶生长

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摘要

The strains at which buckling and debond growth occur in adhesively bonded composite flanges containing an initial debond were experimentally measured. Test parameters including initial debond geometry, flange material stiffness, and the adhesive critical strain energy release rate (G_c) were investigated. Debond growth was found to be strongly dependent on initial debond length but weakly dependent on flange width; i.e., debonding resistance did not increase in direct proportion with the bonded overlap dimension. Flanges having higher bending stiffness exhibited significantly lower debonding strain. Finally, the effect of G_c was evaluated at three levels by controlling the adhesive cure temperature and bondline thickness. Lower values of G_c (207 and 552 J/m~2) allowed debond growth to occur while at the highest value of G_c (1500 J/m~2), alternate failure modes occurred prior to debond growth. Ultrasonic C-scans revealed that debond growth occurred along a curved front, as dictated by the post-buckling deformation of the flanges.
机译:实验测量了在包含初始脱粘的粘合复合材料法兰中发生翘曲和脱粘生长的应变。研究了包括初始脱胶几何形状,法兰材料刚度和粘合剂临界应变能释放速率(G_c)在内的测试参数。发现脱胶的增长在很大程度上取决于初始脱胶长度,而在较小程度上取决于法兰宽度。即,抗脱粘性与粘合的搭接尺寸不成正比。具有较高弯曲刚度的法兰表现出明显较低的脱粘应变。最后,通过控制粘合剂的固化温度和粘合线的厚度,在三个级别上评估了G_c的效果。较低的G_c值(207和552 J / m〜2)允许脱胶生长,而当最高的G_c(1500 J / m〜2)时,替代的破坏模式发生在脱胶之前。超声波C扫描显示,脱模生长沿弯曲的前部发生,这是由于法兰的屈曲后变形所决定的。

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