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On thermomechanical stress analysis of adhesively bonded composite joints in presence of an interfacial void

机译:关于存在界面空隙的胶粘复合接头的热机械应力分析

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This paper deals with analytical thermomechanical stress analysis of adhesively bonded composite joints in presence of a structural imperfection in the form of an interfacial void within the adhesive layer based on the full layerwise theory (FLWT). The joints are subjected to mechanical tension, uniform temperature change, or steady-state heat conduction. The proposed adhesive joint is divided into three distinct regions along its length and a large number of mathematical plies through its thickness. Three sets of fully coupled governing equilibrium equations are derived employing the principle of minimum total potential energy. The three-dimensional nonlinear interlaminar stress distributions along the bond-line in the interior region and near the edges are obtained. The results, showing fast convergence speed and quite agreement with the finite element method, reveal that the presence of such defect within the adhesive layer can increase the stress concentrations resulting in premature failure and debonding. (C) 2015 Elsevier Ltd. All rights reserved.
机译:本文基于全层理论(FLWT),对存在结构缺陷的胶合复合材料接头的热力学应力分析进行了分析,胶合层内存在界面空隙。关节承受机械张力,均匀的温度变化或稳态热传导。所提出的粘合接头沿其长度分为三个不同的区域,并且沿其厚度分布有大量数学层。利用最小总势能原理导出了三组完全耦合的控制平衡方程。得到在内部区域和边缘附近沿粘结线的三维非线性层间应力分布。结果表明收敛速度快,并且与有限元方法完全吻合,结果表明,在粘合剂层中存在此类缺陷会增加应力集中,从而导致过早失效和剥离。 (C)2015 Elsevier Ltd.保留所有权利。

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