Simulating the warping of thin coated Si wafers using Ansys layered shell elements

摘要

The feasibility of simulating thin-film-on-substrates behaviour of large thin coated wafers using Ansys (R) "layered shells" is estimated. Layered shell elements are based on Mindlin-plates with coupled intrinsic layers. These elements can be used with an update Lagrange algorithm (NLGEOM). They are of interest because they are easy to use and require a minimum of degrees of freedom to discretize a coated wafer. More traditional discretisations with two separate element layers are used for evaluating the Finite Element (FE) solution.