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机译:一维声子晶体中带隙上界面粘合剂层的热调谐
Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China|Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Zhejiang, Peoples R China|Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China;
Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China;
Zhejiang Univ, Ningbo Inst Technol, Ningbo 315100, Zhejiang, Peoples R China;
Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China;
Zhejiang Univ, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Zhejiang, Peoples R China|Zhejiang Univ, Dept Engn Mech, Hangzhou 310027, Zhejiang, Peoples R China|Zhejiang Univ, Soft Matter Res Ctr, Hangzhou 310027, Zhejiang, Peoples R China;
Phononic crystal; Thermal tuning; Transfer matrix method;
机译:考虑粘合剂层的2D声子晶体带间隙的热调谐
机译:一种包含高T-C超导体和磁致伸缩材料的一维声腔晶体中函声带间隙的演变
机译:在界面处具有纳米级周期性波纹的一维声子晶体中的声子带隙。 FDTD和PWM仿真
机译:界面特性对一维声晶带空隙的影响
机译:声子晶体的带隙工程和声子准晶体的能隙结构研究。
机译:具有与变形无关的带隙的软声子晶体
机译:一维声晶频带间隙的全局敏感性分析