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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications
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Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

机译:基于LTCC技术制造的用于微处理器供电应用的薄型集成电感器

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摘要

A novel low profile power inductor suitable for planar integration is designed and fabricated based on low temperature co-fired ceramics technology for microprocessor power delivery applications. The inductor was designed to operate at a switching frequency of 4 to 5MHz, carrying a nominal dc current of 20A with a ripple current of 8 to 10A in a 5-V to 1-V dc-dc converter. The design and fabrication procedure is discussed in this paper, followed by small signal measurement and magnetic characterization results. The inductor was implemented in a prototype converter and the large signal measurement results are presented and its performance evaluated
机译:基于低温共烧陶瓷技术,设计并制造了一种适用于平面集成的新型薄型功率电感器,用于微处理器功率传输应用。该电感器设计为在4至5MHz的开关频率下工作,在5V至1V dc-dc转换器中承载20A的标称直流电流和8至10A的纹波电流。本文讨论了设计和制造过程,然后介绍了小信号测量和磁特性分析结果。该电感器在原型转换器中实现,并给出了大信号测量结果并评估了其性能

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