Lifetime Prediction of Non-Collapsible Solder Joints in LTCC/PWB Assemblies Using a Recalibrated Engelmaier's Model

摘要

The thermal fatigue endurances of lead-free ($phi$ 500 and 1100 $mu{rm m}$) plastic core solder ball (PCSB) ball grid array interconnections were investigated. The test assemblies were exposed to thermal cycling testing in temperature ranges of 0–100$^{circ}{rm C}$ and ${-}{40}$ to ${+}{125}$ $^{circ}{rm C}$. In addition, optical microscopy and scanning electron microscopy were used to characterize the interconnections. The characteristic lifetime data from this and earlier studies were contrasted with a recalibrated Engelmaier's model. After adjusting the model, feasibility was determined through test results of a partial array representing a real-use case. On the basis of this paper it was found that the recalibrated Engelmaier's model is, after adjustment, a suitable model for predicting the lifetime of PCSB assemblies.