...
首页> 外文期刊>Circuits, systems, and signal processing >Automatic On-Die Impedance Matching in Current Mode Off-Chip Signaling
【24h】

Automatic On-Die Impedance Matching in Current Mode Off-Chip Signaling

机译:电流模式片外信令中的自动片上阻抗匹配

获取原文
获取原文并翻译 | 示例
           

摘要

A system for on-die automatic impedance matching in current mode off-chip signaling is described. In order to perform the automatic matching operation, an algorithm that integrates the sign of the impedance matching error and the sign of the coupling branch current is implemented. An advantage of the proposed system is that it works without interfering with the driver operation. The transistor level circuit implementation of the system is described and computational simulations with post layout extractions are presented. Also experimental results are shown in order to prove the performance of the system.
机译:描述了一种用于在电流模式片外信令中的管芯上自动阻抗匹配的系统。为了执行自动匹配操作,实现了一种将阻抗匹配误差的符号和耦合支路电流的符号进行积分的算法。所提出的系统的优点在于,其在不干扰驾驶员操作的情况下工作。描述了系统的晶体管级电路实现,并给出了具有后期布局提取的计算仿真。还显示了实验结果,以证明系统的性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号