sn-parameter performance degradation by hot electron induced for N-MOS'/> Symptom reliability: S-parameters evaluation of power laterally diffused-metal–oxide–semiconductor field-effect transistor after pulsed-RF life tests for a radar application
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Symptom reliability: S-parameters evaluation of power laterally diffused-metal–oxide–semiconductor field-effect transistor after pulsed-RF life tests for a radar application

机译:症状可靠性:雷达应用脉冲射频寿命试验后,功率横向扩散金属氧化物半导体场效应晶体管的S参数评估

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摘要

This paper treats thensn-parameter performance degradation by hot electron induced for N-MOSFET devices used in radar applications. This study is relevant for devices operating in the RF frequency regime. The power LD-MOSFET device (0.8 µm channel length, Gate oxide thickness 0.065 µm and 2.2 GHz) are designed and fabricated. Subsequently, life tests in pulsed RF cause, after ageing, the electrical behaviour and its relation with charge trapping at the interface are presented and discussed. Unlike all other current methods, a complete evaluation of S parameters is carried out to obtain key information concerning the defects location. Thensn-parameter performance degradation can be explained by the transconductance and the miller capacitance move, and by the leakage current augmentation IG, which is shown by hot-carrier event from the Si/SiOn2ninterface state generation and/or in a build up of negative charge. Also, the degradation can be predicted by the experimental correlation of RF and dc performance shifts, favour by the measurement of dc performance or initial leakage current. The analysis accompanied proves that thensn-parameters shift by hot electron induced and should be taken into consideration in the design. Through physical processes of ATLAS-SILVACO simulations these degradation phenomena are located and confirmed
机译:然后,本文将处理 s n参数性能下降。这项研究与在射频频率范围内运行的设备有关。设计并制造了功率LD-MOSFET器件(沟道长度为0.8μm,栅氧化层厚度为0.065μm和2.2μGHz)。随后,提出并讨论了老化后的脉冲RF寿命原因的电性能及其与电荷俘获的关系。与所有其他当前方法不同,对S参数进行完整评估以获得与缺陷位置有关的关键信息。然后 s n参数性能的下降可以通过跨导和密勒电容移动以及泄漏电流增大IG来解释,这可以通过Si / SiOn 2 n接口状态生成和/或负电荷的积累。同样,可以通过RF和dc性能变化的实验相关性来预测性能下降,而通过测量dc性能或初始泄漏电流则可以预测这种劣化。伴随的分析证明, s n参数因热电子感应而移动,在设计中应予以考虑。通过ATLAS-SILVACO模拟的物理过程,可以找到并确认这些退化现象

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